摘要
讨论了采用熔渗法制备高密度钨铜和钼铜合金,综合其密度、比热容、热膨胀系数、导热系数等基本数据,比较了合金的热物理性能及其应用上的特点。结果表明:与W-Cu合金相比,Mo-Cu合金从热力学角度考虑制备更困难,采用特殊工艺方可获得高致密性;Mo-Cu合金质轻且散热速率和稳定性优良,与常用基片材料Al2O3、芯片材料GaAs的热膨胀匹配性更好。
The preparation of high-density Mo-Cu and W-Ca alloys using infiltration technology were discnssed. Based on the fundamental data of density, specific heat, thermal-expansion and heat-passage coefficients, thermal physical properties and applications of the two alloys were contrasted and discussed. It turned out that compared with W-Cu alloys, high-density Mo-Cu alloys were more difficult to obtain in thermodynamics unless special technique was adopted; Mo-Cu alloys were excellent for its lower density, better heat dissipation rate and stability. In addition, the thermal-expansion matching of Mo-Cu alloy to some certain chip materials was splendid.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2008年第2期240-244,共5页
Chinese Journal of Rare Metals
关键词
钼铜
钨铜
热膨胀匹配
散热速率
导热系数
Mo-Cu
W-Cu
heat expansion matching
heat-dissipation rate
thermal coefficient
