摘要
具有高导热性的铜基封装材料可以满足大功率器件即时快速大量散热的要求,是一种重要的封装材料。综述了Cu/Mo、Cu/W传统铜基封装材料和Cu/C纤维、Cu/Invar(Mo、Kovar)/Cu层状材料、Cu/ZrW2O8(Ti-Ni)负热膨胀材料及Cu/SiC、Cu/Si轻质材料等新型铜基封装材料的性能特点、制备工艺与问题。指出轻质Cu/Si复合材料将是铜基封装材料中一个新的具有前景的研究方向。
Copper matrix composite is a type of important material for electronic packaging, which can fulfill the requirements of quick and substantive heat dissipation for high power devices. Performance, preparation methods and issues in application of Cu/W and Cu/Mo traditional packaging materials, Cu/C fiber packaging materials, Cu/Invar （Mo, Kovar）/Cu layer-structured packaging materials, Cu/ZrW2O8 （TiNi） negative thermal expansion packaging materials, and Cu/SiC and Cu/Si low-density packaging materials are reviewed in this paper. Moreover, it＇s predicted that lightweight Cu/Si composites will be a prospective direction for the R ＆ D of novel copper matrix packaging materials.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2009年第15期24-28,共5页
Materials Reports
基金
国家自然科学基金(50871078)
教育部新世纪优秀人才项目资助项目
关键词
铜基复合材料
电子封装
碳化硅
硅
copper matrix composites, electronic packaging, silicon carbide, silicon
