摘要
采用Gleeble—3500D热模拟机,在烧结温度为800℃,烧结时间为3 min的条件下,借助金相显微镜、扫描电镜、显微硬度测试计分析,研究了电场对烧结W-xCu(x=10%,20%,30%和40%)(质量分数)体系的影响。结果表明:本条件下,可得到密度较高、组织较均匀细小的烧结体;并且随着Cu含量的增加,烧结体致密化程度逐步提高,组织更加均匀,晶粒更加细小,平均晶粒尺寸从1.0μm降到0.3μm;但烧结体的硬度会相应降低。
Using the thermal simulation instrument Gleeble-3500D, the effect of sintering W-xCu（x = 10%, 20%, 30% and 40 %） （mass fraction） system at a sintering temperature of 800 ℃ and sintering time of 3 min under the action of electric field was studied by the analysis of metallographic microscope, SEM and microhardness instrument. The results show that sintered compacts with relative high density and homogeneous and fine microstructure can be acquired in this experimental condition; furthermore, the increasing of Cu content is beneficial to sintering densification, and the sintered compacts＇ microstructure is more homogeneous and its grain is finer, the average size is decreased from 1.0 μm to 0.3 μm. Sintered compacts＇ hardness is gradually decreased as Cu content increases.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第12期32-35,共4页
Electronic Components And Materials
基金
国家自然科学基金青年基金资助项目(50404014)
中国博士后科学基金资助项目(20060390177)
关键词
金属材料
烧结
电场
W-Cu合金
CU含量
烧结性能
metallic material
sintering
electric field
W-Cu alloy
Cu content
sintering property
