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Sn-9Zn共晶型无铅焊料的大气腐蚀行为 被引量:1

ATMOSPHERIC CORROSION OF Sn-9Zn EUTECTIC Pb-FREE SOLDER
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摘要 采用户外大气暴露和人工模拟溶液的方法.研究了Sn-9Zn合金在大气环境和腐蚀性溶液中的腐蚀行为.结果表明,在户外大气暴露12天,合金表面已发生明显的腐蚀;腐蚀产物的微观形貌主要有刺球状和针状两种;除Zn与Sn以外,腐蚀产物中还含有大量的0,分析认为可能是一种Sn—Zn的氢氧化物;在实验条件范围内,合金在腐蚀溶液中腐蚀速度相对较快,在15天内平均腐蚀质量损失达到0.20mg/dm^2~0.25mg/dm^2,表面腐蚀速度与腐蚀溶液中盐的浓度关系不大. Sn-9Zn alloy is a low cost eutectic Pb-free solder. Since Zn exists in the alloy,the corrosion resistance is poor. Present work was focused on the corrosion behavior of Sn-9Zn in both outdoor atmosphere and an artificial simulated solution. The corrosion product was observed by SEM and analyzed by EDAX. The results showed that in the case of atmosphere corrosion, the surface of the alloy suffered from obvious corrosion after expoure for 12 days only. The morphology of the corrosion product mainly presents as thorn spheres and needles. Except Sn and Zn,there was a lot of oxygen in the corrosion product. Zn(OH) 2 as one of the corrosion product was assumed in the discussion. Moreover, the corrosion rate was relatively fast in the artificial solution, the average corrosion rate of the alloy was up to 0. 20 - 0. 25 mg/dm^2 within 15 days. In this experiment ,the corrosion rate of the alloy was little influenced by the concentration of the corrosive salt in the solution.
作者 冼俊扬
出处 《腐蚀科学与防护技术》 CAS CSCD 北大核心 2008年第5期347-349,共3页 Corrosion Science and Protection Technology
关键词 无铅焊料 Sn合金 大气腐蚀 Pb-free solder tin alloy Zn atmosphere corrosion
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  • 1Olli G, Destouni G. Long-tenn heavy metal loading to nearshore lake sediments [ J ]. Water Air and Soil Pollution, 2008, 192(1 -4) :105. 被引量:1
  • 2[美]刘汉诚(Hohn HLau)等著,姜岩峰,张常年译.电子制造技术[M].北京:化学工业出版社,2005.220. 被引量:1
  • 3Glazer J,Metallurgy of low temperature Pb-free solders for electronic assembly[ J]. Inter. Mater. Rev. , 1995,40(2) :65. 被引量:1
  • 4Mccormack M,Jin S. Improved mechanical properties in new Pb -free solder alloy[J]. J. Electr. Mater. ,1994,23(8) :715. 被引量:1
  • 5刘晓英,于大全,马海涛,谢海平,王来.Y_2O_3增强Sn-3Ag-0.5Cu复合无铅钎料[J].电子工艺技术,2004,25(4):156-158. 被引量:18
  • 6王慧,薛松柏,韩宗杰,王俭辛.Sn-Zn系无铅钎料的研究现状及发展趋势[J].焊接,2007(2):31-35. 被引量:15
  • 7Mohanty U S, Lin K L. Electrochemical corrosion behavior of lead-free Sn-8.5Zn-XAg-0. 1Al-0. 5Ga solder in 3.5% NaCI solution[ J]. Materials Science & Engineering,2005,406:34. 被引量:1
  • 8Vaynman S, Fine M E. Development of fluxes for lead-free solders containing Zinc [ J ]. Scripta Mater, 1999,41 ( 12 ) : 1269. 被引量:1
  • 9程兰征.物理化学[M].大连:大连工学院出版社,1979.51. 被引量:1

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