摘要
研究了Sn-8Zn-3B i-xP钎料的抗氧化性、熔点、组织及力学性能.热重分析表明:P元素的加入显著降低了钎料熔体表面的氧化量;采用俄歇能谱分析氧化层的成分和厚度,发现含P的钎料表面形成的ZnO层厚度明显降低,约为80 nm;对合金进行差热分析发现少量P的加入并不改变钎料的熔点和熔程;P的加入对钎料合金的强度几乎没有影响,但却降低了合金的塑性,这是因为含P合金中有粗大的富Zn相形成,断口分析显示在Zn相与Sn相晶界上容易出现裂纹,从而导致钎料的塑性下降.
The oxidation resistance, melting point, microstructures, and mechanical properties of Sn8Zn-3Bi-xP solders were investigated. The results show that minute amount of phosphorus can significantly improve the oxidation resistance of Sn-SZn-3Bi lead-free solders. Auger electron spectrometer （AES） analysis reveals that the depth of oxidation in Sn-SZn-3Bi alloys can be reduced by adding a little phosphorus. With additional alloy element phosphorus, the depth of oxidation is about 80 nm. Small amount of phosphorus has no obvious influence on the melting point and the pasty range of Sn8Zn-3Bi solders. The primary Zn phase appears in the matrix of P-contained alloys. Cracks are apt to occur along the interfaces of the primary Zn phase and Sn phase, which causes deterioration of elongation of the alloys.
出处
《东南大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2006年第5期831-835,共5页
Journal of Southeast University：Natural Science Edition
关键词
无铅钎料
磷
抗氧化性能
力学性能
lead-flee solder
phosphorus
oxidation resistance
mechanical property
