摘要
无铅波峰焊接工艺相比有铅波峰焊接工艺显得复杂和难以控制。通过采用DOE和波峰焊工艺分析相结合的方法,设计无铅波峰焊工艺,大大降低了缺陷率,提高了无铅波峰焊接质量,在生产实践中具有很大的指导意义。
The process of lead-free wave soldering compared to SnPb wave soldering is so complex and difficult to control. In this paper the process was designed by the combination of DOE （design of experiment） and analysis of the process, and the amount of defect declined greatly, also the quality of soldering joints was enormously improved. This is method which has signification for guidance in production.
出处
《电子工业专用设备》
2008年第9期30-34,共5页
Equipment for Electronic Products Manufacturing
关键词
无铅波峰焊
DOE
工艺分析
焊接缺陷
焊接质量
Lead-free wave soldering
Design Of experiments
Process analysis
Solder defect
Solder quality
