摘要
随着各国对环境保护的日益重视,在波峰焊技术中选用无铅焊料焊接印制板势在必行。因为无铅钎料的成分配比不同于有铅钎料,因此在无铅钎焊时其工艺流程、工艺参数也有所改变。利用正交试验法进行无铅波峰焊工艺试验,并对所得到的正交试验数据进行分析,寻求工艺参数的最佳组合,得到的无铅波峰焊优化工艺参数为:锡炉温度为260℃,钎剂类型选用IF2005C,传送带速度为1.2m/min,预热温度为120℃。
Pb-free wave soldering technology will be used in PCB soldering because of environment question. Composition propotion of Pb-freesolder is different from that of Pb-Sn solder, so its soldering parametars will be changed. Experiments were carried out by using the method oforthogonal experiment, and the data of the previous orthogonal experiment were analyzed to find optimum process parametars. The results are asfollows; welding temperature is 260 ℃; flux type is IF2005C; transmission speed is 1.2 m/min; preheating temperature is 120 ℃.
出处
《焊接》
北大核心
2008年第2期49-52,共4页
Welding & Joining
关键词
无铅波峰焊
正交试验
钎焊性
Pb-free wave soldering, orthogonal experiment, soldering procedure
