摘要
本文分析了双面抛光机的抛光原理,建立了晶片在抛光过程中运动的数学模型,采用VC语言对双面抛光加工进行运动仿真,分析了不同参数对抛光效果的影响,获得了最合理的抛光运动参数,并且在抛光机上得到了验证。
This article has analyzed the two-sided buffing machine polishing principle, has established the chip in the polishing process the movement mathematical model, uses the Visual C＋＋ language to carry on the movement simulation to the two-sided polishing processing, analyzed the different parameter to polish the eff^t the influence, has obtained the most reasonable polishing parameter of movement, and obtained the confirmation on the buffing machine.
出处
《现代制造技术与装备》
2008年第4期17-18,25,共3页
Modern Manufacturing Technology and Equipment
基金
江苏省科技厅科技攻关项目(BE2007077)
江苏省高校自然科学基础研究项目(06KJB460119)
江苏省大学生实践创新训练计划项目(07SSJCX011)
盐城市科技局科技发展计划项目(YK2007018)
关键词
蓝宝石
化学机械抛光
运动分析
计算机仿真
sapphire, chemistry machinery polishing, movement analysis, computer simulation
