摘要
对电子封装工业生产中无铅合金焊料的回流曲线工艺进行了研究,引入了3种不同回流因子,即加热因子、预热因子、冷却因子。针对不同回流因子,分析了其剪切试验中剪切断面的形貌和成分,研究表明,大部分务件下断裂一般会发生在焊料内部区域,然而在焊料界面结合较弱时,断裂通常会发生在金属间化合物和基板界面处。总结提出了3种回流因子的合理取值范围,得到回流炉中Sn3.5Ag0.5Cu的最佳回流曲线,为工业上探索新的回流曲线提供了实验方法。
The reflow curve process of lead-free solder in the electronic packaging industrial production is investigated. Reflow process factors include preheating factor, heating factor and cooling factor. A shear test method for solder joint in microelectronic packaging is proposed to analyse morphology and composition, by which three reflow factors can be factorively suppressed. In all samples, the fracture mainly occurrs in the bulk solder. However, for the joint strengthen becomes lower, the fracture occurrs in the interfacial area between IMC and substrates. The best reflow profile of Sn3. SAg0. 5Cu is supposed, which is developed to use a new reflow process in practice
出处
《材料导报》
EI
CAS
CSCD
北大核心
2008年第5期146-148,共3页
Materials Reports
