摘要
通过体视显微镜和CCD等视频设备录制、焊膏回流动态测试方法,观察焊膏回流的整个过程,有助于分析焊膏回流过程中出现的问题,弥补了目前焊膏–锡珠试验只能观察最终结果,而不能对中间过程进行评价的缺点。利用该方法研究了保温时间和焊膏活性对焊膏回流性能的影响,对焊膏的收球性能进行了评价。结果表明:焊膏回流的保温时间有一定限制,超过限制,产生缺陷的机会大大增加;对于活性较强的焊膏,可以通过增加焊膏的黏性,减少锡珠和立碑以及元件歪斜倾向;通过对不同焊膏的回流过程进行对比,提出了焊膏收球性能良好的参考标准。
Dynamic test of solder reflow process by microscope, CCD etal video picture, has been introduced. The whole process of solder reflow is not only observed but also analyzed conveniently by this method. At the same time, deficiencies in the solder paste-tin ball testing were avoided that only the final pattern of the process could be available and its middle process could not be observed. By the dynamic testing of solder reflow process, the effect of preflow time on performance was studied and the performance of solder paste shrinking to a sphere was evaluated. The experiment results showed that there was a limitation of the temperature keeping time during the paste reflowing and the faults would be increased greatly if the time over limitation. Possibility of solder balls, tombstoning and deflection of elements is reduced when the viscosity of solder paste increased and a better reference of solder reflow process was offered by comparison of different solder reflow processes.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第6期38-41,共4页
Electronic Components And Materials
基金
"863"资助项目(2002AA404110及2001AA421290)
