摘要
随着芯片集成度的不断提高、器件尺寸的不断缩小,光刻技术和光刻设备发生着显著变化。通过对目前国内外光刻设备生产厂商对下一代光刻技术的开发及目前已经应用到先进生产线上的光刻技术及设备进行了对比研究,对光刻技术和光刻设备的发展趋势进行了介绍,并对我国今后半导体光刻技术及设备的发展提出了合理化建议。
Lithography technology and equipments are in a significant improvement with high chip integration and the device size scaling down. The development trends of lithography and equipments for semiconductor fabrication are discussed through the current requirements for next generation lithography technology of lithography equipment manufactgrers domestic and abroad, and by comparing the lithography technology and equipments applied to advanced production line, and reasonable proposal development trend is given.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第3期193-196,共4页
Semiconductor Technology
关键词
光刻
光刻机
分辨率
掩模
焦深
曝光
lithography
mask aligner
resolution
mask
depth of focus （DOF）
exposure
