摘要
根据实验样品的成分，制定一定的浮法成型的温度制度，采用自制小型石墨锡槽，模拟硼硅酸盐玻璃的浮法成型过程，用电子探针结合能谱仪，测试浮法硼硅酸盐玻璃在1250～650℃温度范围内不同温度段下表面渗锡的分布情况，研究硼硅酸盐玻璃不同于传统钠钙硅浮法玻璃的渗锡特点。研究结果表明，在特定的浮法工艺制度下，硼硅酸盐玻璃渗锡的深度达到40μm左右，并且高温段锡离子以纵向深度扩散为主，低温下锡离子主要在玻璃的近表面富集。在浮法成型的过程中，渗锡的分布曲线上会出现卫星峰，但是最终在出锡槽的温度下渗锡曲线是单调递减的。
Using a special mini - graphite tin bath to simulate the float process of float borosilicate glass, the tin penetration profiles in different temperature area from 1 250 ℃ to 650 ℃ were studied by EPMA/EDS. It was found out that tin diffused into the borosilicate glass with a total depth of 40μm. Tin ion diffused towards the deeper layer in the borosilicate glass under the higher temperature and only entered the superficial layer under the lower temperature. In the whole float processes, the tin penetration profiles showed a tin hump, but the tin hump disappeared at the temperature at oudet of tin bath.
出处
《玻璃与搪瓷》
CAS
2007年第5期11-15,共5页
Glass & Enamel
基金
湖北省重点科技攻关项目(2004AA1031303)
关键词
浮法硼硅酸盐玻璃
渗锡
电子探针
扩散系数
float borosilicate glass
tin penetration
electron probe microanalyzer
diffusion coefficient
