摘要
以Sn2.5Ag0.7Cu为基础,添加微量的稀土(RE)r(Ce︰La)为4︰1,研究了钎焊接头的显微组织与力学性能。结果表明:添加微量的RE后,钎料与Cu试样间的界面层厚度明显减小,且界面处的组织更加平滑,相应地其剪切强度随微量RE的添加而增大,并在RE含量(质量分数)为0.1%时达到最大值36MPa。
The Sn2.5Ag0.7Cu solder alloy was selected out by comprehensive comparison. Minute amount of RE r （Ce ： La=4 ： 1） was added into Sn2.5Ag0.7Cu solder, the effects of different amount of RE on microstructure and mechanical properties of the alloy were analyzed. The results indicate that its interfacial ply will be decrease and microstructure will be smoothness if the RE is added. The shear-resistant strength will be improved along with the increasing of the content of RE, it maximal value is 36 MPa when the content of RE is about 0.1%.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第10期74-76,共3页
Electronic Components And Materials
基金
河南省高效创新人才基金资助项目(教高2004-294)
关键词
金属材料
无铅钎料
显微组织
力学性能
melallic material
lead-free solder
microstructure
mechanic properties
