摘要
从黏弹性角度研究电路板组件跌落冲击作用下的动力学特性。电路板基板材料主要以高分子树脂为主,是典型的黏弹性材料。为了简化分析,假设电路板四边简支。从黏弹性角度,基于板模型计算电路板在跌落冲击作用下的动力学响应。结果表明,电路板的黏性系数和尺寸对板的动力学特性有显著影响。这不仅有助于认清电路板跌落冲击作用下的真实动力学特性,完善其理论研究;还为电路板可靠性设计和可靠度评估提供理论依据。
Dynamic properties of printed circuit board assembly under drop impact were investigated when viscoelastic property of substrate materials was considered. Main materials of printed circuit board （PCB） substrate were macromolecule resins, which were typi- cal viscoelastic materials. It was necessary for analytical simplicity to assume that PCB was simply supported along its edges. From the point of view of viscoelasticity, dynamic responses of PCB under drop impact were calculated based on plate theory. The results show that the viscoelasticity of PCB and its size have distinct influence on dynamic properties of PCB under board-level drop impact. This not only contributes to understanding real dynamic characteristics of PCB under drop impact and perfecting theory research, but also provides a reference for reliability design and evaluation of PCB.
出处
《机械强度》
EI
CAS
CSCD
北大核心
2007年第5期713-716,共4页
Journal of Mechanical Strength
基金
航天技术创新基金项目资助。~~
关键词
电路板
跌落冲击
动力学分析
黏弹性
Printed circuit board
Drop impact
Dynamics analysis
Viscodasticity
