摘要
本文阐述了作为电路板的接地散热金属板,可伐合金、钛、铝及其合金镀覆可焊性镀层的工艺技术,并对几种可焊性镀层的品质做了评价.
This paper discusses the processing technique of plating weldability layer upon ground radiating metal plate such as koval,TI,AL andits alloys, and it reviews several weldable plating layer.
出处
《电子器件》
CAS
1997年第1期659-663,共5页
Chinese Journal of Electron Devices
