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V型微通道热沉的流体流动与传热问题研究 被引量:2

Research on Fluid Flow and Heat Transfer of the V-Shaped Microchannel Heat Sink
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摘要 V型微通道热沉具有体积小、流速小、散热效率高等优点,是将多个DL线阵组装为面阵并实现高性能冷却封装的良好解决方案.本文采用计算流体力学软件Fluent建立了V型微通道的数值模型,研究了其中的流体流动与传热问题.仿真结果表明,设计的V型微通道可满足激光二极管线阵的散热要求.仿真分析结果与V型微通道热沉样品的模拟热源加载实验测试数据对比,吻合较好,证明了数值仿真的有效性. V-shaped microchannel has the advantages of small volume, low flow velocity and high efficiency. V-shaped microchannel is a cooling scheme which assembled multi diode laser bars into an array to achieve high performance cooling package. The paper adopted fluent software to set up a numerical model of V shaped microchannel and researched the fluid and heat transfer of the V-shaped microchannel. The simulation results have been proved to be that V-shaped microchannel can improve the heat dissipation ability of the diode laser arrays. The experiment of the simulated load addition of thermal source has been carried out and tested the cooling performance of V-shaped microchannel with the V-shaped microchannel sample. The experimental data is agreed well with the simulation result and proves the validity of simulation result.
出处 《传感技术学报》 CAS CSCD 北大核心 2006年第05A期1683-1685,共3页 Chinese Journal of Sensors and Actuators
基金 国防基础研究项目资助(K1303060115)
关键词 微电子机械系统 V型微通道 热沉 MEMS V-shaped microchanel heat sink
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参考文献8

  • 1文建国,蔡德芳,王石语,李汉国,冯倩,过振.大功率DPL中激光二极管热负荷及散热技术[J].西安电子科技大学学报,2000,27(4):463-466. 被引量:7
  • 2Tuckerman D B,Pease R F W. High Performance Heat Sinking for VLSI [J]. IEEE Electron Device I.etters, 2 (5):126-129, 1981. 被引量:1
  • 3NG E Y K,POH S T. Investigative Study of Manifold Microchannel Heat Sinks for Electronic Cooling Design [J]. Journal of Electronics Manufacturing, 9 (2) : 155-166,1999. 被引量:1
  • 4Sanjay K. Roy,Branko L. Avanic. A Very High Heat Flux Microchannel Heat Exchanger for Cooling of Semiconductor Laser Diode Arrays [J]. IEEE Transactions on Components,Packaging and Manufacturing Technology-part B, 19 (2): 444-451,1996. 被引量:1
  • 5Benett W,Freitas B.Beach R.D. Ciarlo et al. Microchannel Heatsinks for High Average Power Laser Diode arrays [J]. Lair Diode Technology and Application IV. 1634 : 453-465,1992. 被引量:1
  • 6Skidmore J A, Freitas B L,Crawford J, atariano J S, Utterback E,DiMercurio L, Cutter K and Sutton S. Silicon Monolithic Microchannel-cooled Laser Diode Array[J]. Applied Physics Letters, 77(1):10-12, 2000. 被引量:1
  • 7Copeland D. Manifold Microchannel Heat Sinks:Analysis and Optimization[C]//ASME/JSME Thermal Engineering Conference, 15:169-174,1995. 被引量:1
  • 8Tuckerman D B, Heat Transfer Microstructures for Integrated Circuit[M]. Stanford University. 1984. 被引量:1

二级参考文献2

  • 1王石语,中国激光,1999年,26卷,10期,939页 被引量:1
  • 2滕明,红外与激光工程,1994年,23卷,4期,58页 被引量:1

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