摘要
介绍多种硅片键合技术及其在基于高莱盒(Golay-cell)原理的微机械红外探测器中的应用。对多种键合方法在该器件中的实验结果进行比较,确定了现阶段最优的键合方法,即采用局部电场屏蔽方法的阳极键合方法,键合成功率在90%以上,并初步实现了器件的标准化制作。
This paper introduces different kinds of silicon bonding technologies and their application in micromachined infrared detector based on Golay-cell structure. The experiment results for different bonding technologies used in the detector device were compared, and an optimum bonding method was found, which is the local electrostatic shield anodic bonding technology. The successful bonding probability is 90% above. A standardized process is initially used in the detector fabrication.
出处
《仪器仪表学报》
EI
CAS
CSCD
北大核心
2006年第8期936-939,共4页
Chinese Journal of Scientific Instrument
基金
北京市教委(KM200310005009)资助项目
