摘要
研究了在环氧树脂塑料封装材料表面制备导电聚吡咯(PPy)薄膜的化学聚合方法,分析了影响聚吡咯薄膜微观形貌、附着力及电导率的因素。用四探针法测聚吡咯薄膜的电导率,并用扫描电子显微镜(SEM)、红外光谱(IR)、X射线光电子能谱(XPS)进行了表征。通过对电子封装材料的表面预处理与改性,制得了附着性好、均匀连续的聚吡咯薄膜,经掺杂电导率达到了45.10S/cm。
Polypyrrole film was prepared on the surface of epoxy resin plastic electronic packaging materials by chemical polymerization method. Effect factors of micro-morphology, adhesion and conductivity of polypyrrole film were analyzed. The conductivity of PPy film was measured by the four-point probe method and the samples were characterized by scanning electron microscopy （SEM）, infrared spectrum （IR） and X-ray photoelectron spectroscopy （XPS）. A homogeneous and compact polypyrrole film was obtained through pretreatment and mod- ification by surfactant to the surface of electronic packaging,and the conductivity got to 45.10S/cm by doping.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2006年第7期1051-1053,共3页
Journal of Functional Materials
基金
国家自然科学基金资助项目(60071027)
天津市自然科学基金资助项目(023603811)
关键词
聚吡咯薄膜
电子封装材料
化学聚合
polypyrrole film
electronic packaging materials
chemical polymerization
