摘要
研究了在环氧树脂封装材料表面进行化学镀铜时前处理过程中最佳粗化工艺条件:300g/LCrO3,225mL/LH2SO4,温度85℃,时间30min。对粗化后的环氧树脂封装材料表面进行了SEM形貌分析、表面粗糙度及表征亲水性的接触角的计算。结果表明,采用的化学粗化工艺适用于此种环氧树脂基材料,在最佳工艺条件下可以得到较好的化学镀铜层,镀层与样件表面的结合力达到5B级,且镀层能起到较好的电磁屏蔽效果。
The optimized coarsening pretreatment process for electroless copper plating of epoxy resin packaging material was established. Thus the morphology of the epoxy resin packaging material after coarsening pretreatment was observed using a scanning electron microscope, while its surface roughness and water contact angle were measured. It was found that the surface of the epoxy resin packaging material could be well chemically coarsened by immersing in the mixed solution of 300 g/L CrO3 and 225 mL/L H2SO4 at 85℃ for 30 min. The resulting electroless copper coating on the coarsened surface had an adhension to the substrate as much as 5B grade and good electromagnetic shielding performance as well.
出处
《材料保护》
CAS
CSCD
北大核心
2006年第12期19-22,共4页
Materials Protection
关键词
化学镀
粗化
环氧树脂
封装材料
电磁屏蔽
electroless copper plating
surface coarsening
epoxy resin
packaging material
electromagnetic shielding
