摘要
应用热分析技术,能在产品的设计阶段获得其温度分布,从而优化设计,提高产品可靠性。介绍了用计算机进行辅助热分析的数值方法和热分析软件的特点。并用Icepak软件对某电子设备进行了热分析,并把仿真结果与实验值进行了比较,验证了方法的正确性。同时还对电子设备的散热进行了改进,并通过计算,获得了满足要求的优化设计参数。
The temperature distriction of a product can be obtained to optimize the design and improve the reliability by the technology of thermal analysis in the phase of design. Numerical methods of computer aided thermal design and technology characteristic of thermal analysis software are introduced. Then, the thermal simulation of some electronic system be given. By contrast the result of simulation with experimentation to certify the validity of the method. And the thermal control means of the electronic system are improved. By numerical simulation, the Optimum design parameter of fulfilling thermal control requires can be gained.
出处
《电子工艺技术》
2006年第3期165-167,181,共4页
Electronics Process Technology
关键词
电子设备
热设计
计算机辅助热设计
可靠性
Electronic system
Thermal design
Computer aided thermal design ：Reliability
