摘要
按一定比例把两种聚合物(HTC-1,THE-5)及金刚砂均匀混合后,对光纤光栅(FBG)进行封装处理,然后分别对其应变、温度、抗压强度等特性进行研究;封装后光纤光栅的应变和温度传感线性度非常好,均达到0.99以上,应变线性范围超过8000微应变,与裸光纤光栅的测试结果相比灵敏度系数提高了3.5倍,温度灵敏度系数提高7倍左右,抗压强度为65MPa,完全满足土木结构的智能监测需要。
FBG was packaged by a compound containing two kinds of polymers（ HTC - 1, THE - 5 ） and emery mixed in certain proportion. The characteristics of the packaged FBG were tested including stain, temperature, anti - stress strength etc. The packaged FBG performs a good linearity of both strain and temperaturesensing. The linearity reaches 0.99 above and the range of linear strain is in excess of 8000tta . Compared with the naked FBG, the strain and tempreatuer sensitivity coefficients of the packaged FBG increase 3.5 and 7 times respectively. Furthermore the anti - stress strength of the packaged FBG is 65Mpa. These performannces will comlpletely satisfy the requirements of intelligent inspection of construction.
出处
《激光杂志》
CAS
CSCD
北大核心
2005年第4期71-72,共2页
Laser Journal
基金
宁波市重点博士基金(项目号:01J201201-04)的资助。
关键词
光纤光栅
聚合物封装
应力传感
温度传感
抗压强度
fiber Bragg grating
polymer packaging
strain sensing
temperature sensing
anti - stress strength
