摘要
随着以IP核复用为基础的SoC设计技术的发展,工业界及研究组织正积极从事相关IP互联标准方案的制定工作。本文介绍了目前SoC设计中常用的三种片上总线标准,即IBM公司的CoreConnect总线、ARM公司的AMBA总线和OCPIP组织的OCP总线,重点分析和比较了它们的特性,并针对它们不同的特点,阐述其合适的应用领域。
With the development of SoC design technology based on IP core re-usability, people in the industrial sector and research institutes are devoting themselves to stipulation of IP interconnection standard. At present, three typical on-chip bus specifications, such as CoreConnect of IBM company, AMBA of ARM company, OCP of OCP-IP organization are usually used in SoC design. Their features are analyzed and compared and finally, their applied domains are presented accordingly.
出处
《山东科技大学学报（自然科学版）》
CAS
2005年第2期66-69,共4页
Journal of Shandong University of Science and Technology(Natural Science)
