摘要
介绍了评价电迁移可靠性的高温恒定电流试验方法,以电阻值超过初始值10%为失效判据,对某工艺的几组样品进行可靠性评价。该试验方法简便、可靠,适用于亚微米和深亚微米超大规模集成电路的可靠性评价。
A electromigration assessment method based on the constant current at high temperature is introduced; moreover,the reliability of electromigration is evaluated according to the failure criterion that resistance R exceeds the initial value R0 by 10 percent. This method is convenient and reliable in use. It is suitable for the reliability evaluation of sub-micrometer and deep sub-micrometer VLSI.
出处
《电子产品可靠性与环境试验》
2004年第6期49-52,共4页
Electronic Product Reliability and Environmental Testing
