摘要
介绍了一种利用激光制备线路板的新方法———激光微熔覆柔性布线技术 ,根据其原理和特点 ,设计并制造了相应的柔性布线系统 ,重点介绍了其软硬件组成。最后 。
A novel method to fabricate circuit board by laser micro-cladding technology was introduced in this paper. According to its characteristics, the laser direct fabrication system was designed and manufactured. Corresponding hardware and software were described in detail. Finally, some applications of this system were presented.
出处
《应用激光》
CSCD
北大核心
2004年第5期258-260,共3页
Applied Laser
基金
国家自然科学基金项目(50075030)
国家"863"项目(2001AA421290)
