基于GaN功率放大器模块化、小型化的发展需求,设计了一款X波段小型管壳封装的功率放大器。通过合理排布电路结构,实现了封装尺寸的小型化。由于器件功率密度不断提升,散热问题不容忽视,通过对不同材料的管壳底座进行热仿真分析,模拟芯...基于GaN功率放大器模块化、小型化的发展需求,设计了一款X波段小型管壳封装的功率放大器。通过合理排布电路结构,实现了封装尺寸的小型化。由于器件功率密度不断提升,散热问题不容忽视,通过对不同材料的管壳底座进行热仿真分析,模拟芯片的温度分布,根据仿真结果选定底座材料为钼铜Mo70Cu30,利用红外热成像仪测试芯片结温为107.83℃,满足I级降额要求。最终设计的功率放大器尺寸为18.03 mm×8.70 mm×3.03 mm,在28 V工作电压脉冲测试条件下,9.3~9.5 GHz频带内饱和输出功率大于46 d Bm,功率附加效率大于36%,功率增益大于24.5 d B,电性能测试结果全部满足技术指标要求。展开更多
We propose a miniaturized wideband metasurface antenna for 60-GHz antenna-in-package applications.With the glass integrated passive device manufacturing technology,we introduce a coplanar-waveguide-fed(CPW-fed)ring re...We propose a miniaturized wideband metasurface antenna for 60-GHz antenna-in-package applications.With the glass integrated passive device manufacturing technology,we introduce a coplanar-waveguide-fed(CPW-fed)ring resonator to characterize the material properties of the glass substrate.The proposed antenna is designed on a high dielectric constant glass substrate to achieve antenna miniaturization.Because of the existence of gaps between patch units compared with the conventional rectangular patch in the TM10 mode,the radiation aperture of this proposed antenna is reduced.Located right above the center feeding CPW-fed bow-tie slot,the metasurface patch is realized,supporting the TM10 mode and antiphase TM20 mode simultaneously to improve the bandwidth performance.Using a probe-based antenna measurement setup,the antenna prototype is measured,demonstrating a 10-dB impedance bandwidth from 53.3 to 67 GHz.At 60 GHz,the antenna gain measured is about 5 dBi in the boresight direction with a compact radiation aperture of 0.31λ0×0.31λ0 and a thickness of 0.06λ0.展开更多
文摘基于GaN功率放大器模块化、小型化的发展需求,设计了一款X波段小型管壳封装的功率放大器。通过合理排布电路结构,实现了封装尺寸的小型化。由于器件功率密度不断提升,散热问题不容忽视,通过对不同材料的管壳底座进行热仿真分析,模拟芯片的温度分布,根据仿真结果选定底座材料为钼铜Mo70Cu30,利用红外热成像仪测试芯片结温为107.83℃,满足I级降额要求。最终设计的功率放大器尺寸为18.03 mm×8.70 mm×3.03 mm,在28 V工作电压脉冲测试条件下,9.3~9.5 GHz频带内饱和输出功率大于46 d Bm,功率附加效率大于36%,功率增益大于24.5 d B,电性能测试结果全部满足技术指标要求。
基金supported by the National Key R&D Program of China(Nos.2018YFE0205900 and 2016YFC0800400)the National Science and Technology Major Project,China(No.2018ZX03001008)the National Natural Science Foundation of China(Nos.61306030 and 61674037)。
文摘We propose a miniaturized wideband metasurface antenna for 60-GHz antenna-in-package applications.With the glass integrated passive device manufacturing technology,we introduce a coplanar-waveguide-fed(CPW-fed)ring resonator to characterize the material properties of the glass substrate.The proposed antenna is designed on a high dielectric constant glass substrate to achieve antenna miniaturization.Because of the existence of gaps between patch units compared with the conventional rectangular patch in the TM10 mode,the radiation aperture of this proposed antenna is reduced.Located right above the center feeding CPW-fed bow-tie slot,the metasurface patch is realized,supporting the TM10 mode and antiphase TM20 mode simultaneously to improve the bandwidth performance.Using a probe-based antenna measurement setup,the antenna prototype is measured,demonstrating a 10-dB impedance bandwidth from 53.3 to 67 GHz.At 60 GHz,the antenna gain measured is about 5 dBi in the boresight direction with a compact radiation aperture of 0.31λ0×0.31λ0 and a thickness of 0.06λ0.
