摘要
基于GaAsE/D赝配高电子迁移率晶体管（PHEMT）工艺、多层陶瓷管壳工艺和芯片微组装工艺技术,设计并制作了一种微波小型化封装四通道多功能电路。该多功能电路集成了通道选择、6bit移相和4bit衰减等功能,由低噪声放大器（LNA）芯片、功分开关网络多功能芯片（MFC）、数控移相衰减多功能芯片、3-8译码器芯片和多层陶瓷外壳组成。测试结果表明,在频率为2.0-3.5GHz时,电路增益大于16dB,噪声系数小于1.3dB,端口电压驻波比（VSWR）小于1.5∶1,多功能电路采用＋5V/-5V供电,工作电流分别为110mA@＋5V,48mA@-5V。多功能电路的封装尺寸为19.0mm×17.0mm×3.1mm。
Based on GaAsE/D pseudomorphic high electron mobility transistor（ PHEMT） process,multi-layer ceramic package process and micro package process with chips,a quad-channel multifunction circuit with miniature package was designed and fabricated. The circuit integrated the functions of channel choice,6 bit phase shift and 4 bit attenuation consists of the low noise amplifier（ LNA） chip,splitter and switch multifunction chip（ MFC）,digital phase shifter and attenuator MFC,3-8 decoder chip and multi-layer ceramic package. The test results show that the gain of the circuit is more than16 d B,the noise figure is less than 1. 3 dB,and the voltage standing wave ratio（ VSWR） is 1. 5 ∶ 1from 2. 0 GHz to 3. 5 GHz. The circuit power supply is ＋5 V /-5 V and the currents are 110 m A@ ＋5 V and 48 m A @- 5 V,respectively. The size of the package for the multifunction circuit is 19. 0 mm×17. 0 mm×3. 1 mm.
出处
《半导体技术》
CAS
CSCD
北大核心
2015年第7期489-493,共5页
Semiconductor Technology
关键词
小型化封装
多功能电路
多层陶瓷管壳
四通道
功分开关
移相器
衰减器
miniature package
multifunction circuit
multi-layer ceramic package
quad-channel
splitter and switch
phase shifter
attenuator
