摘要
元件的小型化高密度封装形式越来越多,如多模块封装(MCM),系统封装(SiP),倒装晶片(FC)等应用得越来越多。这些技术的出现更加模糊了一级封装与二级装配之间的界线,勿庸置否,随着小型化高密度封装的出现,对高速与高精度装配的要求变得更加关键。相关的组装设备和工艺也更具先进性与高灵活性。由于倒装晶片比BGA或CSP具有更小的外形尺寸,更小的球径和球间距,它对植球工艺,基板技术,材料的兼容性,制造工艺以及检查设备和方法提出了前所未有的挑战。
Miniaturized and high density packages get more and more versions, for example, MCM, SiP, Flip Chip, etc. Its applications are getting more and more practice. The traditional packaging hierarchy is getting not so clear because of the emergence of these new technology. No doubt, as the appearance of miniaturization and high density packages, high speed and high accuracy is more and more critical to the assembly process. The related manufacturing equipments and process shall be more advanced and flexible.
Because flip chip has more smaller outline size, smaller bump size and extra fine pitch than BGA or CSP, there are big challenges we never face in conventional surface mount process, such as bumping technology, substrate technology, the compatibilities between materials, assembly process, inspection equipments and methods.
出处
《电子工业专用设备》
2007年第12期1-7,共7页
Equipment for Electronic Products Manufacturing
