This article provides a review of current research activities that concentrate on Ti3SiC2. We begin with an overview of the crystal and electronic structures, which are the basis to understand this material. Following...This article provides a review of current research activities that concentrate on Ti3SiC2. We begin with an overview of the crystal and electronic structures, which are the basis to understand this material. Followings are the synthetic strategies that have been exploited to achieve, and the formation mechanism of Ti3SiC2. Then we devote much attentions to the mechanical properties and oxidation/hot corrosion behaviors of Ti3SiC2 as well as some advances achieved recently. At the end of this paper, we elaborate on some new discoveries in the Ti3SiC2 system, and also give a brief discussion focused on the ＂microstructure -property＂ relationship.展开更多
六方晶 Ti_3SiC_2是由 Si 原子形成的 Si 层被 TiC 八面体连接起来构成的层状晶体结构。这种结构赋予它象石墨一样具有润滑性和可加工性。它同时结合了金属和陶瓷的许多优良性能,具有较好的导电性和导热性,高温延性,抗热震,高强度以及...六方晶 Ti_3SiC_2是由 Si 原子形成的 Si 层被 TiC 八面体连接起来构成的层状晶体结构。这种结构赋予它象石墨一样具有润滑性和可加工性。它同时结合了金属和陶瓷的许多优良性能,具有较好的导电性和导热性,高温延性,抗热震,高强度以及抗氧化等。在国内外研究资料的基础上,对此材料的晶体结构、制备方法、各种性能等方面的研究做了较系统地论述,并展望了此材料的研究方向。展开更多
In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carrie...In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.展开更多
基金supported by the National Outstanding Young Scientist Foundation for Y.C. Zhou under Grant No. 59925208the National Natural Science Foundation of China under Grants No. 50232040, No. 50302011 and No. 90403027"863" Project,and High-Tech Bureau of the Chinese Academy of Sciences
文摘This article provides a review of current research activities that concentrate on Ti3SiC2. We begin with an overview of the crystal and electronic structures, which are the basis to understand this material. Followings are the synthetic strategies that have been exploited to achieve, and the formation mechanism of Ti3SiC2. Then we devote much attentions to the mechanical properties and oxidation/hot corrosion behaviors of Ti3SiC2 as well as some advances achieved recently. At the end of this paper, we elaborate on some new discoveries in the Ti3SiC2 system, and also give a brief discussion focused on the ＂microstructure -property＂ relationship.
文摘六方晶 Ti_3SiC_2是由 Si 原子形成的 Si 层被 TiC 八面体连接起来构成的层状晶体结构。这种结构赋予它象石墨一样具有润滑性和可加工性。它同时结合了金属和陶瓷的许多优良性能,具有较好的导电性和导热性,高温延性,抗热震,高强度以及抗氧化等。在国内外研究资料的基础上,对此材料的晶体结构、制备方法、各种性能等方面的研究做了较系统地论述,并展望了此材料的研究方向。
文摘In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.
