An integrable silicon-on-insulator （SOl） power lateral MOSFET with a trench gate and a recessed drain （TGRD MOSFET） is proposed to reduce the on-resistance. Both of the trench gate extended to the buried oxide （...An integrable silicon-on-insulator （SOl） power lateral MOSFET with a trench gate and a recessed drain （TGRD MOSFET） is proposed to reduce the on-resistance. Both of the trench gate extended to the buried oxide （BOX） and the recessed drain reduce the specific on-resistance （Ron, sp） by widening the vertical conduction area and shortening the extra current path. The trench gate is extended as a field plate improves the electric field distribution. Breakdown voltage （BV） of 97 V and Ron, sp of 0.985 mf2-cm2 （l/os = 5 V） are obtained for a TGRD MOSFET with 6.5/xm half-cell pitch. Compared with the trench gate SOI MOSFET （TG MOSFET） and the conventional MOSFET, Ron＇ sp of the TGRD MOSFET decreases by 46% and 83% at the same BV, respectively. Compared with the SOI MOSFET with a trench gate and a trench drain （TGTD MOSFET）, BV of the TGRD MOSFET increases by 37% at the same Ron,sp.展开更多
基金supported by the National Natural Science Foundation of China(Nos.60976060,61176069)the National Key Laboratory of AnalogIntegrated Circuit(NLAIC),China(No.9140C090304110C0905)the State Key Laboratory of Electronic Thin Films and Integrated Devices,China(No.CXJJ201004)
文摘An integrable silicon-on-insulator （SOl） power lateral MOSFET with a trench gate and a recessed drain （TGRD MOSFET） is proposed to reduce the on-resistance. Both of the trench gate extended to the buried oxide （BOX） and the recessed drain reduce the specific on-resistance （Ron, sp） by widening the vertical conduction area and shortening the extra current path. The trench gate is extended as a field plate improves the electric field distribution. Breakdown voltage （BV） of 97 V and Ron, sp of 0.985 mf2-cm2 （l/os = 5 V） are obtained for a TGRD MOSFET with 6.5/xm half-cell pitch. Compared with the trench gate SOI MOSFET （TG MOSFET） and the conventional MOSFET, Ron＇ sp of the TGRD MOSFET decreases by 46% and 83% at the same BV, respectively. Compared with the SOI MOSFET with a trench gate and a trench drain （TGTD MOSFET）, BV of the TGRD MOSFET increases by 37% at the same Ron,sp.
