The deformation behaviors of as-sintered CNT/Al-Cu composites were investigated by isothermal compression tests performed in the temperature range of 300-550°C and strain rate range of 0.001-10 s-1 with Gleeble 3...The deformation behaviors of as-sintered CNT/Al-Cu composites were investigated by isothermal compression tests performed in the temperature range of 300-550°C and strain rate range of 0.001-10 s-1 with Gleeble 3500 thermal simulator system.Processing maps based on dynamic material model(DMM)were established at strains of 0.1-0.6,and microstructures before and after hot deformation were characterized by scanning electron microscopy(SEM),electron backscatter diffraction(EBSD)and high-resolution transmission electron microscopy(HRTEM).The results show that the strain has a significant influence on the processing maps,and the optimum processing domains are at temperatures of 375-425°C with strain rates of 0.4-10 s-1 and at 525-550°C with 0.02-10 s-1 when the strain is 0.6.An inhomogeneous distribution of large particles,as well as a high density of tangled dislocations,dislocation walls,and some sub-grains appears at low deformation temperatures and strain rates,which correspond to the instability domain.A homogeneous distribution of fine particles and dynamic recrystallization generates when the composites are deformed at 400 and 550°C under a strain rate of 10 s-1,which correspond to the stability domains.展开更多
采用原位反应近液相线铸造方法制备Al2O3P/Al-Cu复合材料,对其进行二次加热,研究晶粒的形貌演变和长大规律。用光学显微镜观察组织结构,应用Image Pro Plus软件测量并统计出平均晶粒尺寸及合金液相体积分数,并与理论计算数值进行比较。...采用原位反应近液相线铸造方法制备Al2O3P/Al-Cu复合材料,对其进行二次加热,研究晶粒的形貌演变和长大规律。用光学显微镜观察组织结构,应用Image Pro Plus软件测量并统计出平均晶粒尺寸及合金液相体积分数,并与理论计算数值进行比较。结果表明,在590℃保温10～60 min后,不含Al2O3颗粒的Al-6.8%Cu基体合金平均晶粒尺寸为89～132μm,液相体积分数为14%～26.8%,而3.6 wt%Al2O3P/Al-6.8%Cu复合材料的平均晶粒尺寸为73-107μm,液相体积分数为11.6%～20.9%。说明Al2O3颗粒在合金的二次加热过程中对晶粒长大行为及液相体积分数的增长均有明显的抑制作用,从而为优化半固态组织提供了一种新思路。展开更多
The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted...The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted by transmission electron microscope（TEM）, scanning electron microscope（SEM）, peeling tests and tensile tests. It is found that the ultra-fine grained laminated composites with tight bonding interface are prepared by the roll bonding technique. The annealing prompts the atomic diffusion in the interface between dissimilar matrixes, and even causes the formation of intermetallic compounds. The interfacial bonding strength increases to the maximum value owing to the interfacial solution strengthening at 300 °C annealing, but sharply decreases by the damage effect of intermetallic compounds at elevated temperatures. The composites obtain high tensile strength due to the Al crystallization grains and Cu twins at 300 °C. At 350 °C annealing, however, the composites get high elongation by the interfacial interlayer with submicron thickness.展开更多
基金Project(52265043)supported by the National Natural Science Foundation of ChinaProject(2021A1515010470)supported by the Natural Science Foundation of Guangdong Province,China+1 种基金Project(ZK2023(014))supported by the Guizhou Provincial Science and Technology Projects,ChinaProject(YQK[2023]011)supported by the Outstanding Youth Science and Technology Talent Project of Guizhou Province,China。
基金Project(KJ1601321)supported by Scientific and Technological Research Program of Chongqing Municipal Education Commission,ChinaProject(cstc2017jcyjAX0378)supported by the Chongqing Research Program of Basic Research and Frontier Technology,China
文摘The deformation behaviors of as-sintered CNT/Al-Cu composites were investigated by isothermal compression tests performed in the temperature range of 300-550°C and strain rate range of 0.001-10 s-1 with Gleeble 3500 thermal simulator system.Processing maps based on dynamic material model(DMM)were established at strains of 0.1-0.6,and microstructures before and after hot deformation were characterized by scanning electron microscopy(SEM),electron backscatter diffraction(EBSD)and high-resolution transmission electron microscopy(HRTEM).The results show that the strain has a significant influence on the processing maps,and the optimum processing domains are at temperatures of 375-425°C with strain rates of 0.4-10 s-1 and at 525-550°C with 0.02-10 s-1 when the strain is 0.6.An inhomogeneous distribution of large particles,as well as a high density of tangled dislocations,dislocation walls,and some sub-grains appears at low deformation temperatures and strain rates,which correspond to the instability domain.A homogeneous distribution of fine particles and dynamic recrystallization generates when the composites are deformed at 400 and 550°C under a strain rate of 10 s-1,which correspond to the stability domains.
文摘采用原位反应近液相线铸造方法制备Al2O3P/Al-Cu复合材料,对其进行二次加热,研究晶粒的形貌演变和长大规律。用光学显微镜观察组织结构,应用Image Pro Plus软件测量并统计出平均晶粒尺寸及合金液相体积分数,并与理论计算数值进行比较。结果表明,在590℃保温10～60 min后,不含Al2O3颗粒的Al-6.8%Cu基体合金平均晶粒尺寸为89～132μm,液相体积分数为14%～26.8%,而3.6 wt%Al2O3P/Al-6.8%Cu复合材料的平均晶粒尺寸为73-107μm,液相体积分数为11.6%～20.9%。说明Al2O3颗粒在合金的二次加热过程中对晶粒长大行为及液相体积分数的增长均有明显的抑制作用,从而为优化半固态组织提供了一种新思路。
基金Projects(50971038,51174058)supported by the National Natural Science Foundation of China
文摘The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted by transmission electron microscope（TEM）, scanning electron microscope（SEM）, peeling tests and tensile tests. It is found that the ultra-fine grained laminated composites with tight bonding interface are prepared by the roll bonding technique. The annealing prompts the atomic diffusion in the interface between dissimilar matrixes, and even causes the formation of intermetallic compounds. The interfacial bonding strength increases to the maximum value owing to the interfacial solution strengthening at 300 °C annealing, but sharply decreases by the damage effect of intermetallic compounds at elevated temperatures. The composites obtain high tensile strength due to the Al crystallization grains and Cu twins at 300 °C. At 350 °C annealing, however, the composites get high elongation by the interfacial interlayer with submicron thickness.
