We presented the analysis of the incomplete conduction in bonding medium in high power GaN-based light-emitting diode (LED) packages. A numerical study was carried out with parametric model to understand the junction ...We presented the analysis of the incomplete conduction in bonding medium in high power GaN-based light-emitting diode (LED) packages. A numerical study was carried out with parametric model to understand the junction temperature variation due to bonding medium defects. Transient thermal measurement was performed to evaluate LED’s junction temperature. Thermal resistance from chip to lead frame was 20 K/W in our sample LED. It was suggested that only 60% of the surface area of the bonding medium was involved in the thermal conduction. This result was also supported by the SEM image. Blocking of thermal path induced by ineffective area of the bonding medium was regarded as a factor of its thermal resistance. Thus, the effective area of the bonding medium should be included in the FEM model and considered as another important factor in high power LED’s thermal management.展开更多
In this paper,by proposing a novel and low-cost Ag salt paste,a robustly and large-area(35×35 mm^(2))bare Cu to Cu bonding was realized under a low sintering pressure of 0.8 MPa and a low sintering temperature of...In this paper,by proposing a novel and low-cost Ag salt paste,a robustly and large-area(35×35 mm^(2))bare Cu to Cu bonding was realized under a low sintering pressure of 0.8 MPa and a low sintering temperature of 300℃ in air atmospheric conditions.The relationship between the bonding strength and microstructure changes of sintered Ag under various bonding conditions was investigated in detail.The large-area bonded plate exhibits low porosity about 10%and low percentage of voids,which result in ultra-high bonding strength over 58 MPa.More importantly,the introduction of reducing agent formic acid(CH_(2)O_(2))and the low porosity successfully improve the anti-oxidation of novel Ag salt paste during sintering process,result in pure Cu-Ag-Cu bonding.The cross-section of the Ag joints was obtained to explain the bonding pattern,in which Cu was oxidized only at the edge of the sintering interface,and no Cu oxide generated in middle bonding section.The development of novel Ag salt paste successfully addresses the energy-intensive process and low bonding strength faced by large-scale sintering,which greatly promotes the high-temperature applications of power device.展开更多
Investigations of technological characteristics and bonding mechanism of field-assisted bonding are done, which are for bonding of electrolytes (Pyrex glass) to monocrystal silicon and aluminum. The features of micros...Investigations of technological characteristics and bonding mechanism of field-assisted bonding are done, which are for bonding of electrolytes (Pyrex glass) to monocrystal silicon and aluminum. The features of microstructure and the distribution of the diffused elements in the bonding interface area are studied by means of SEM, EDX and XRD, and the influence of the technological factors on the bonding process is also studied. The model of 'metal-oxides-glass' of bonding structure and ions diffusion and bonding in the condition of electrical field-assisted are indicated.展开更多
Roller Compacted Concrete (RCC) has gained favorable recognition in hydropower and water resource dam construction. With optimization in construction technology and materials used for RCC Dams, cost is no longer a maj...Roller Compacted Concrete (RCC) has gained favorable recognition in hydropower and water resource dam construction. With optimization in construction technology and materials used for RCC Dams, cost is no longer a major disadvantage as compared to environmental impact, that is, wildlife habitat disruption. In as much as it has become optimal for investment in hydropower dam construction, the scourge for dam failure is still eminent, which is as a result of excessive seepage compromising the integrity of the mechanical properties of the dam. The aim of the paper is to highlight successful application methods in joint bonding to avoid excessive seepage and reduce the autogenous healing to a few years of operation. In view of optimization, this paper presents a comprehensive study on the influences of interlayer joints bonding quality from RCC mix performances and how it consolidates the RCC layers to withstand the shear strength along the interface, especially on the high dams. The case study is the RCC dam at the 750 MW Kafue Gorge Lower Hydropower Station. The scope of the study reviews the joint type judged by Modified Maturity Factor (MMF) with joint surface long time exposed in regions with dry and high temperature, technical measures of layer bonding quality control under condition of long time joint surface exposure, effects of joints shear strength and impermeability of the RCC layers when under the conditions of plastic and elasticity. The subtle observations made during the dam construction phases were with respect to the optimal use of materials in relation to RCC mix designs and the basis for equipment calibration for monitoring important data that can be referenced during analysis of shear forces acting on the RCC dam over time.展开更多
基金supported by the Natural Science Foundation of China, the Principal’s Fund of Peking University (Grant No. 60676032)the National Found for Fostering Talents of Basic Science (Grant No. NFFTBSJ0630311)
文摘We presented the analysis of the incomplete conduction in bonding medium in high power GaN-based light-emitting diode (LED) packages. A numerical study was carried out with parametric model to understand the junction temperature variation due to bonding medium defects. Transient thermal measurement was performed to evaluate LED’s junction temperature. Thermal resistance from chip to lead frame was 20 K/W in our sample LED. It was suggested that only 60% of the surface area of the bonding medium was involved in the thermal conduction. This result was also supported by the SEM image. Blocking of thermal path induced by ineffective area of the bonding medium was regarded as a factor of its thermal resistance. Thus, the effective area of the bonding medium should be included in the FEM model and considered as another important factor in high power LED’s thermal management.
基金partly supported a project (JPNP14004) commissioned by the New Energy and Industrial Technology Development Organization (NEDO)the supporting from TOPPAN FORMS CO.,LTD,Japan
文摘In this paper,by proposing a novel and low-cost Ag salt paste,a robustly and large-area(35×35 mm^(2))bare Cu to Cu bonding was realized under a low sintering pressure of 0.8 MPa and a low sintering temperature of 300℃ in air atmospheric conditions.The relationship between the bonding strength and microstructure changes of sintered Ag under various bonding conditions was investigated in detail.The large-area bonded plate exhibits low porosity about 10%and low percentage of voids,which result in ultra-high bonding strength over 58 MPa.More importantly,the introduction of reducing agent formic acid(CH_(2)O_(2))and the low porosity successfully improve the anti-oxidation of novel Ag salt paste during sintering process,result in pure Cu-Ag-Cu bonding.The cross-section of the Ag joints was obtained to explain the bonding pattern,in which Cu was oxidized only at the edge of the sintering interface,and no Cu oxide generated in middle bonding section.The development of novel Ag salt paste successfully addresses the energy-intensive process and low bonding strength faced by large-scale sintering,which greatly promotes the high-temperature applications of power device.
基金This project is supported by Foundation of Taiyuan University of Technology "211" Project, China (No.20304006).
文摘Investigations of technological characteristics and bonding mechanism of field-assisted bonding are done, which are for bonding of electrolytes (Pyrex glass) to monocrystal silicon and aluminum. The features of microstructure and the distribution of the diffused elements in the bonding interface area are studied by means of SEM, EDX and XRD, and the influence of the technological factors on the bonding process is also studied. The model of 'metal-oxides-glass' of bonding structure and ions diffusion and bonding in the condition of electrical field-assisted are indicated.
文摘Roller Compacted Concrete (RCC) has gained favorable recognition in hydropower and water resource dam construction. With optimization in construction technology and materials used for RCC Dams, cost is no longer a major disadvantage as compared to environmental impact, that is, wildlife habitat disruption. In as much as it has become optimal for investment in hydropower dam construction, the scourge for dam failure is still eminent, which is as a result of excessive seepage compromising the integrity of the mechanical properties of the dam. The aim of the paper is to highlight successful application methods in joint bonding to avoid excessive seepage and reduce the autogenous healing to a few years of operation. In view of optimization, this paper presents a comprehensive study on the influences of interlayer joints bonding quality from RCC mix performances and how it consolidates the RCC layers to withstand the shear strength along the interface, especially on the high dams. The case study is the RCC dam at the 750 MW Kafue Gorge Lower Hydropower Station. The scope of the study reviews the joint type judged by Modified Maturity Factor (MMF) with joint surface long time exposed in regions with dry and high temperature, technical measures of layer bonding quality control under condition of long time joint surface exposure, effects of joints shear strength and impermeability of the RCC layers when under the conditions of plastic and elasticity. The subtle observations made during the dam construction phases were with respect to the optimal use of materials in relation to RCC mix designs and the basis for equipment calibration for monitoring important data that can be referenced during analysis of shear forces acting on the RCC dam over time.
