基于3D打印技术,通过合理调配各材料之间的成分比例,精确控制打印参数与烧结工艺,成功制备出不同尺寸规格的硼硅酸盐/氧化铝陶瓷复合材料体系的低温共烧陶瓷(LTCC)基板,并对打印过程进行分析,对基板的微观结构、致密度以及介电性能进行...基于3D打印技术,通过合理调配各材料之间的成分比例,精确控制打印参数与烧结工艺,成功制备出不同尺寸规格的硼硅酸盐/氧化铝陶瓷复合材料体系的低温共烧陶瓷(LTCC)基板,并对打印过程进行分析,对基板的微观结构、致密度以及介电性能进行了测试。结果表明:当打印速度为300 mm/min,气压为150 k Pa时打印的基板性能良好,表面粗糙度为(0.93±0.05)μm,厚度为(105±10.2)μm,在850℃烧结致密,密度可达(2.5±0.16)g/cm^3,晶粒均匀,且在2.4 GHz下测试试样的平均介电常数为5.4,介电损耗为0.0017,满足LTCC基板的使用要求。展开更多
首先简述了目前LTCC(Low Temperature Co-fired Ceramic,低温共烧陶瓷技术)滤波器的版图结构及其优劣,重点阐述了一种结构紧凑的600MHz低通滤波器的设计,及在这种滤波器制造过程中遇到的工艺难题及解决办法。该滤波器采用介电常数为7.8...首先简述了目前LTCC(Low Temperature Co-fired Ceramic,低温共烧陶瓷技术)滤波器的版图结构及其优劣,重点阐述了一种结构紧凑的600MHz低通滤波器的设计,及在这种滤波器制造过程中遇到的工艺难题及解决办法。该滤波器采用介电常数为7.8、损耗角正切为0.006的微波陶瓷材料,并用场路结合的方法完成其设计,整个器件的尺寸为5.1mm×3.3mm×1.6mm。运用矢量网络分析仪对加工出来的样品进行测试,通过测试数据可以看到,通带最大插入损耗为1.8dB,满足设计指标的要求。该滤波器尺寸小且具有良好的频率响应曲线,在小型化微波通信系统及雷达系统中有着广阔的应用前景。展开更多
The behavior of molten glass on nanostructured silicon surface is of essential importance for the fabrication of a strong bond interface between glass （or glass-based ceramic tapes） and silicon. It was found that ty...The behavior of molten glass on nanostructured silicon surface is of essential importance for the fabrication of a strong bond interface between glass （or glass-based ceramic tapes） and silicon. It was found that typical glasses do not wet the silicon surface that is always coated with a thin silica layer. It is shown that the high surface tension of molten glasses at high temperatures in combination with the dewetting surface of the structured silicon prohibits the formation of an interlocking bond between the two substrates. The theory of wetting can be applied to molten glasses, too. As a consequence, a similar solution as for liquids is investigated： the surface has to be chemically modified to become wettable. Investigations with sputtered metals on the nanostructured silicon improve wetting of the surface and result in a better bond homogeneity of the SiCer compound during sintering with low pressure.展开更多
文摘基于3D打印技术,通过合理调配各材料之间的成分比例,精确控制打印参数与烧结工艺,成功制备出不同尺寸规格的硼硅酸盐/氧化铝陶瓷复合材料体系的低温共烧陶瓷(LTCC)基板,并对打印过程进行分析,对基板的微观结构、致密度以及介电性能进行了测试。结果表明:当打印速度为300 mm/min,气压为150 k Pa时打印的基板性能良好,表面粗糙度为(0.93±0.05)μm,厚度为(105±10.2)μm,在850℃烧结致密,密度可达(2.5±0.16)g/cm^3,晶粒均匀,且在2.4 GHz下测试试样的平均介电常数为5.4,介电损耗为0.0017,满足LTCC基板的使用要求。
文摘首先简述了目前LTCC(Low Temperature Co-fired Ceramic,低温共烧陶瓷技术)滤波器的版图结构及其优劣,重点阐述了一种结构紧凑的600MHz低通滤波器的设计,及在这种滤波器制造过程中遇到的工艺难题及解决办法。该滤波器采用介电常数为7.8、损耗角正切为0.006的微波陶瓷材料,并用场路结合的方法完成其设计,整个器件的尺寸为5.1mm×3.3mm×1.6mm。运用矢量网络分析仪对加工出来的样品进行测试,通过测试数据可以看到,通带最大插入损耗为1.8dB,满足设计指标的要求。该滤波器尺寸小且具有良好的频率响应曲线,在小型化微波通信系统及雷达系统中有着广阔的应用前景。
文摘The behavior of molten glass on nanostructured silicon surface is of essential importance for the fabrication of a strong bond interface between glass （or glass-based ceramic tapes） and silicon. It was found that typical glasses do not wet the silicon surface that is always coated with a thin silica layer. It is shown that the high surface tension of molten glasses at high temperatures in combination with the dewetting surface of the structured silicon prohibits the formation of an interlocking bond between the two substrates. The theory of wetting can be applied to molten glasses, too. As a consequence, a similar solution as for liquids is investigated： the surface has to be chemically modified to become wettable. Investigations with sputtered metals on the nanostructured silicon improve wetting of the surface and result in a better bond homogeneity of the SiCer compound during sintering with low pressure.
