摘要
针对垂直互联柱在LTCC层压过程中产生错位的问题,采用ANSYS有限元仿真软件建立了一种LTCC微波组件的三维模型,分析了LTCC层压工艺参数与垂直互联柱错位的关系。分析结果表明:材料在层压过程中产生的粘性变形是最终导致垂直互联柱产生错位的原因,压力是导致垂直互联柱产生错位的主要因素;选用压力10 MPa、温度50℃、时间6min的层压工艺参数组合,得到的直径0.26mm的垂直互联柱错位度为1.39%。
During LTCC laminating process, the vertical interconnection column will generate misalignment. A three-dimen- sional model of LTCC microwave component is established by finite element software ANSYS, and the influence of LTCC laminating process on vertical interconnection column misalignment is studied. The results show that during LTCC lamina- ting process, the viscous deformation on material eventually leads to vertical interconneetion column misalignment. Pressure is the main factor that leads to the misalignment of vertical interconnection column. Laminating process parameters are com- bined by pressure of 10 MPa, temperature of 50 ℃, time of 6 min and diameter of 0.26 mm, the vertical interconnection column misalignment is 1.39%.
出处
《桂林电子科技大学学报》
2016年第5期421-425,共5页
Journal of Guilin University of Electronic Technology
基金
国防973项目"多能量***研究"
关键词
LTCC
层压工艺
垂直互联柱
错位
LTCC
laminating process
vertical interconnection column
misalignment
