摘要
低温共烧陶瓷(LTCC)技术作为一种新兴的集成封装技术,已成为无源集成的主流技术,在微电子封装陶瓷基板领域得到非常广泛的应用,并随着陶瓷基板集成度的不断提高,对工艺和设备的要求也在发生变化。本文就多个关键工序中工艺和设备的发展趋势进行了研究,并提出了一些工艺难点的解决办法。
Low-temperature co-fired ceramic（ LTCC） which is taken as a kind of integrated packaging technology has become the mainstream technology of passive integration and is widely used in the field of microelectronic packaging ceramic substrate,also with the constant improving of ceramic substrate integration,requirements for processes and equipment are also changing. The paper makes some research on the development trend of techniques and equipment in multiple key processes,and some solutions are put forward on the technological difficulties.
出处
《山西电子技术》
2017年第3期94-96,共3页
Shanxi Electronic Technology
