摘要
采用拟合的方法 ,并利用DESTIN测试系统 ,研究了集成电路金属布线电阻与温度的关系 ;探讨了不同材料、不同尺寸和不同结构金属布线的焦耳热效应 ;揭示了在加速试验 (一定的高电流、高温 )条件下金属化自升温较大 ,必须考虑焦耳热效应作用的原理 ;解决了已往用环境温度代替测试结构表面实际温度所带来的误差 。
By using the fitting method and the DESTIN testing system, the relationship between the temperature and the resistance of the metal interconnector in integrated circuit (IC) was studied, and the Joule-heated effect of the metal interconnectors with various materials, sizes and structures were then investigated. It is revealed that in the accelerating test conditions with high current density and high temperature, the Joule-heated effect must be taken into consideration, for the metal temperature auto-increases rather rapidly. By the proposed method, the error caused by the replacement of real temperature in specimen surface by the circumstance temperature can be settled, thus obtaining the reliability analysis result with more accuracy.
出处
《华南理工大学学报（自然科学版）》
EI
CAS
CSCD
北大核心
2004年第5期34-37,共4页
Journal of South China University of Technology(Natural Science Edition)
关键词
焦耳热效应
集成电路
金属互连
电迁移
Joule-heated effect
integrated circuit
metal interconnector
electromigration
