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nMOSFET X射线辐射影响研究 被引量:3

The influence of X-ray irradiation on nMOSFET
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摘要 介绍了在强电流作用下的ggnMOS作用机理,分析了ggnMOS抗ESD能力的主要表征参数,利用X射线辐射系统和TLP测试系统研究了辐射总剂量对ggnMOS抗ESD能力的影响。试验结果表明,随辐射总剂量的增加,ggnMOS的开启电压、维持电压都将下降,这有利于提高ggnMOS的抗ESD能力,而表征其抗ESD能力的参数(二次击穿电流It2)开始随辐射总剂量的增加而减少,到达一定剂量后将随总剂量的增加而增加。 The operation of ggnMOS under the high current is introduced, the main parameters which stand for the ability of robust ESD of ggnMOS are analyzed too. The influence of Total Dose Irradiation (TDR) on ESD of the gate-grounded nMOSFET is discussed with X-ray technology. It shows that the turn-on voltage/holding voltage decreased with the TDR increased, which is benefit for improving the ability of nMOSFET anti-ESD. And the second breakdown current decreased with the TDR first, then increased with the TDR.
出处 《核电子学与探测技术》 CAS CSCD 北大核心 2004年第3期246-248,245,共4页 Nuclear Electronics & Detection Technology
基金 国家"十五"预研基金(41308060602) 重点实验室基金资助
关键词 栅接地nMOS ESD 辐射总剂量 开启电压 二次击穿电流 X射线辐射 ggnMOS ESD total dose irradiation turn-on-voltage second breakdown current
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参考文献4

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共引文献12

同被引文献12

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