摘要
本文介绍了圆片级封装的设计考虑、基础技术、可靠性、应用情况及发展趋势。
Design Considerations and fundamental technologies and reliability of wafer-level packages (WLP) are introduced.applicatons and future directions of WLP are also described.
出处
《电子与封装》
2004年第1期19-23,共5页
Electronics & Packaging
