摘要
综述了印制电路板(PCB)孔金属化技术及其发展趋势,根据目前PCB孔金属化工艺存在的主要问题,指出了孔金属化工艺改进的途径和研究的方向。
The technology and its development trend of hole metallization in printed circuit board (PCB) are summarized in this paper. Possible paths of improving hole metallization technology and research directions are suggested based on an analysis of the present problems with hole metallization in PCB.
出处
《材料导报》
EI
CAS
CSCD
2003年第4期11-13,20,共4页
Materials Reports
