摘要
针对工程领域中大量存在的含有耦合变量的多目标协同问题,研究了一种基于增广拉格朗日乘子法的渐进式组合优化方法。采用该方法进行目标分解、惩罚参数迭代更新、收敛检验等步骤后,对印制电路板进行优化并计算获得了优化方案和优化目标值。样件测试和分析结果表明,在保持电路板结合强度的同时,渐进式组合优化方法对印制电路板结合强度和热阻性能改善明显,未优化前样件的热阻为13.48 K/W,优化后其热阻值为7.34 K/W,优化后的热阻值满足热阻值≤12.50 K/W的指标要求。这种采用计算机处理的优化方法能非常快速且全面地计算出最优方案,在解决复杂系统中多耦合设计和工艺问题方面具备潜力。
A progressive combinatorial optimization method based on the augmented Lagrangian multiplier method is studied for a large number of multi-objective collaborative problems with coupled variables that exist in the engineering field.After objective decomposition,iterative update of penalty parameters,convergence test and other steps,the printed circuit board is optimized and the optimization scheme and optimization target value are calculated.The test and analysis results of the samples show that the progressive combination optimization method can significantly improve the bonding strength and thermal resistance of the printed circuit board while maintaining the bonding strength of the printed circuit board.The thermal resistance value of the sample before optimization is 13.48 K/W,and the thermal resistance value after optimization is 7.34 K/W.The optimized thermal resistance meets the requirement that the thermal resistance ≤12.50 K/W.This optimization method using computer processing can calculate the optimal solution very quickly and comprehensively,and has the potential to solve the multi-coupling design and process problems in complex systems.
作者
张义萍
樊勋
王天石
张怡
廖旭
张富官
ZHANG Yiping;FAN Xun;WANG Tianshi;ZHANG Yi;LIAO Xu;ZHANG Fuguan(Box 429,Cha Dianzi,Chengdu 610036,China)
出处
《电子质量》
2024年第11期81-85,共5页
Electronics Quality
关键词
多目标协同
印制电路板
渐进式组合优化
结合强度
热阻
multi-objective cooperation
printed circuit board progressive combinatorial optimization
bonding strength
thermal resistance
