摘要
随着电子元件小型化、高集成度和高性能需求的迅猛增长,陶瓷电路板(CCB)因其优异的导热性、耐高温性及力学性能,成为替代传统印刷电路板的重要候选。然而,传统CCB制造流程存在工艺复杂、材料浪费与分辨率较低等问题,无法满足绿色高精密电路与快速原型设计的需求。3D打印技术凭借快速成型、高精度和复杂几何结构制造等优势,被引入CCB制造中,以克服传统方法的局限性,实现陶瓷基底和导电图案的高效制备。本文综述了3D打印CCB的研究进展,同时根据3D打印技术制作部分的不同分为陶瓷基底、导电图案与一体化3D打印3个部分。分析了各项技术在陶瓷基底、导电图案及一体化打印中的优势与不足,最后讨论了目前3D打印技术在CCB制造中面临的问题。基于现有技术,提出了未来发展方向,包括新型材料开发、优势技术集成和智能制造优化。随着多材料打印、混合制造技术的不断成熟,3D打印有望在高性能CCB的批量制造和设计创新方面实现新的突破,为新一代电子器件的研发提供有力支持。
With the rapid growth in demand for miniaturization,high integration,and enhanced performance in electronic components,ceramic circuit boards(CCB)have emerged as a promising alternative to conventional printed circuit boards due to their excellent thermal conductivity,high-temperature resistance,and mechanical strength.However,conventional CCB manu-facturing processes are complex,lead to material waste,and have limited resolution,making it challenging to meet the requirements for green,high-precision circuitry and rapid prototyping.To address these limitations,3D printing technology has been introduced into CCB fabrication,offering advantages such as rapid prototyping,high precision and the ability to create complex geometries to achieve efficient preparation of ceramic substrates and conductive patterns.The research progress in 3D printing CCB was reviewed and the advancements were categorized into three main areas based on different 3D printing applications,including ceramic substrates,conductive patterns,and integrated 3D printing.The strengths and limitations of each technique in producing ceramic substrates,conductive patterns,and integrated CCB printing were analyzed,followed by a discussion on the current challenges faced by 3D printing technology in CCB manufacturing.Based on existing technologies,future development directions were proposed,including the development of novel materials,integration of advantageous technologies,and optimization of intelligent manufacturing.As multi-material printing and hybrid manufacturing technologies continue to mature,3D printing is expected to achieve breakthroughs in the mass production and innovative design of high-performance CCB,providing robust support for the development of next-generation electronic devices.
作者
段培开
张广明
付志国
宋道森
王萌杰
黄杰
赵佳伟
兰红波
DUAN Peikai;ZHANG Guangming;FU Zhiguo;SONG Daosen;WANG Mengjie;HUANG Jie;ZHAO Jiaweia;LAN Hongbo(Shandong Engineering Research Center for Additive Manufacturing,Qingdao University of Technology,Shandong Qingdao 266520,China;School of Mechanical and Automotive Engineering,Qingdao University of Technology,Shandong Qingdao 266520,China)
出处
《精密成形工程》
北大核心
2024年第12期54-67,共14页
Journal of Netshape Forming Engineering
基金
国家自然科学基金(52275345,52175331)
山东省高等学校青创科技扶持计划(2021KJ044)
山东省自然科学基金(ZR2023ME194,ZR2020ZD04)。
关键词
陶瓷电路板
3D打印
陶瓷基底
导电图案
一体化
研究现状
ceramic circuit boards
3D printing
ceramic substrates
conductive patterns
integration
research status
