摘要
为了满足功率日益增长的插箱印制板工作温度要求,采用“插箱框架通液+均温板插件模块”的液冷插箱散热形式。结合插箱外形、插件模块热耗分布要求,对插箱进行结构设计;分析插箱传热路径,基于插箱结构对内部流体流道进行优化设计,在满足流阻要求的情况下,局部采用扰流柱微小流道进行强化换热设计;最后通过热流仿真计算,验证液冷插箱的换热性能及流阻性能。仿真结果表明:该型液冷插箱散热性能良好,可实现单印制板插件模块140 W以上散热,插件散热壳体最高温度75℃。
In order to meet the operating temperature requirements of subrack printed board with increasing power,the liquid cooling subrack cooling form of the liquid passing through subrack frame and the temperature equalization board plug-in module is adopted.According to the appearance of subrack and the heat consumption distribution requirements of the plug-in module,the subrack structure is designed.The heat transfer path of the subrack is analyzed,and the internal fluid flow is optimized based on the subrack structure.When the requirement of flow resistance is met,the spoiler micro-flow path is used to strengthen the heat transfer design locally.Finally,the heat transfer performance and flow resistance performance of the liquid cooling subrack are verified by heat flow simulation.The simulation results show that the cooling performance of the liquid cooling subrack is good,and the heat dissipation of a single printed board subrack module can be more than 140 W,and the maximum temperature of the plug-in cooling shell is 75℃.
作者
张岩
倪洪亮
ZHANG Yan;NI Hongliang(Miltary Respresentative Office of Shanghai Bureau of Naval Armament Department in Yangzhou,Yangzhou 225001,China;The 723 Institute of CSSC,Yangzhou 225101,China)
出处
《舰船电子对抗》
2024年第4期112-116,共5页
Shipboard Electronic Countermeasure
关键词
液冷插箱
微小流道
均温板
热流仿真
换热性能
liquid cooling subrack
micro-flow path
temperature equalization board
heat flow simulation
heat transfer performance
