摘要
采用自制的腈基化聚芳醚砜PESBPh、芳香胺S共改性联苯型邻苯二甲腈树脂DBPh,并将其与填料、促进剂等混合后与石英布复合制备出了一种耐温480℃、阻燃、低介电损耗的改性腈基树脂载体胶膜。研究结果表明,合成的PESBPh增韧树脂为目标产物,适量的PESBPh和芳香胺S的加入改善了腈基树脂的成膜工艺性和韧性,冲击韧性提高至8.7 k J/m^(2)。胶膜经过250℃/6 h固化后,室温剪切强度为13.4 MPa,480℃剪切强度可达5.3 MPa,且在450℃连续使用60 min后,粘接强度保持率大于90%,胶膜介电损耗为0.013,阻燃达到V0级别。胶膜具有良好的自粘性并且室温适用期大于20 d,可作为耐温480℃等级粘接材料应用。
The aromatic amine S and self-prepared phthalonitrile polyether sulphone(PESBPh)resin are used to co-modify biphenyl type phthalonitrile resin(DBPh),then the DBPh is mixed with filler and accelerant and laminated with quartz cloth to prepare a 480℃-resistant,flame-retardant and low dielectric loss modified phthalonitrile resin based supported structural adhesive film.The synthesized toughening PESBPh resin is the objective product,and the results show that the impact toughness increases to 8.7 kJ/m^(2),and the film-formation processability of phthalonitrile resin is also significantly improved by the addition of PESBPh resin and aromatic amine S with proper amounts.After a curing process of 250℃/6 h,the shear strength of adhesive film is 13.4 MPa measured at ambient temperature and 5.3 MPa measured at 480℃.Especially the film can be continuously used for 60 min at 450℃,then the retention of adhesion strength is more than 90%,the dielectric loss is 0.013 and the flame-retardant grade is V0.The adhesive film has a shelf life more than 20 days at ambient temperature and suitable tackiness,which can be applied as a 480℃-resistant adhesion material.
作者
张晓男
王冠
付刚
吴鑫锐
侯忠雨
高堂铃
吴健伟
ZHANG Xiaonan;WANG Guan;FU Gang;WU Xinrui;HOU Zhongyu;GAO Tangling;WU Jianwei(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,China;Shanghai Composite Science&Technology Co.,Ltd.,Shanghai 201112,China)
出处
《化学与粘合》
CAS
2024年第4期330-334,367,共6页
Chemistry and Adhesion
基金
黑龙江省科学院院长基金项目(编号:YZ2022SH01)。
关键词
腈基树脂
480℃
增韧
低介电损耗
阻燃
phthalonitrile resin
480℃
toughening
low dielectric loss
flame-retardant
