摘要
激光制造阻焊图形的新方法是在印制电路板(PCB)制造过程中,当导电线路图形完成后,将在制板上热压非光敏的聚酰亚胺(PI)薄膜作为阻焊材料,直到装联现场再用激光去除覆盖在焊接区表面的PI膜,制造出阻焊图案。在制造阻焊图案的同时,对需去除的阻焊材料下面的铜箔表面进行可焊性处理,并趁铜箔表面新鲜、可焊性良好之际,涂覆焊料,贴装元器件,完成焊接,从而实现激光加工非光敏材料,而且不使用可焊性涂覆层等助焊手段的裸铜焊接。通过实验中的新技术方案,给出了实验流程及其涉及的材料、设备、操作,分析了结果,总结了新技术的优点。
The new method involves hot pressing a non photosensitive polyimide(PI)film onto the printed circuit board(PCB)as a solder mask material after the completion of the conductive circuit pattern,during the PCB manufacturing process.After getting to the PCB assembly site,the polyimide film covering the welding area surface is removed by laser to create a solder mask pattern.While manufacturing solder mask patterns,we perform solderability treatment on the surface of the copper foil underneath the solder mask material that needs to be removed,and while the surface of the copper foil is fresh and has good solderability,we apply solder,mount components,and complete welding.Thus bare copper soldering is achieved through laser processing of non photosensitive materials without the use of soldering aids such as solderability coatings.Through experiments,a new technological solution is implemented,and the experimental process,materials,equipment,and operations involved are presented.The results are analyzed,and the advantages of the new technology are summarized.
作者
岳湘禄
YUE Xianglu(DCT Co.,Ltd.,Tianjin 300392,China)
出处
《印制电路信息》
2024年第7期15-19,共5页
Printed Circuit Information
关键词
激光
聚酰亚胺(PI)
裸铜焊接
阻焊图形
可焊性
laser
polyimide(PI)
bare copper soldering
solder mask pattern
solderability
