摘要
随着印制电路板(PCB)向着高速、高密度方向发展,信号完整性(SI)在PCB设计中显得越来越重要。考虑到后续高速产品对SI的更高要求,研究了PCB板件加工涉及的压合棕化、阻焊前处理采用不同加工处理方式,即不同棕化药水、不同阻焊前处理对SI的影响,为高速PCB板件在粗化处理方面提供数据参考。
With the development of high-speed and high-density circuit board,signal integrity(SI) is becoming more and more important in printed circuit board(PCB) design.Considering the higher requirements for SI in highspeed products,this paper mainly studies the different processing methods of pressing brown-oxide and sold mask pretreatment in PCB processing,as well as the influence of different browning agents and different solder mask pretreatment on SI,which provides data reference for coarsening treatment of high-speed PCB.
作者
邹冬辉
王立刚
陶锦滨
叶霖
王锋
ZOU Donghui;WANG Ligang;TAO Jinbin;YE Lin;WANG Feng(Shenzhen Q&D Circuits Co.,Ltd.,Shenzhen 518103,Guangdong,China)
出处
《印制电路信息》
2024年第2期38-41,共4页
Printed Circuit Information
关键词
棕化处理
阻焊前处理
导体损耗
趋肤效应
brown-oxide treatment
sold mask pretreatment
loss of conductor
skin effect
