摘要
具有通孔结构的金刚石在高精度引线成形及高功率微波器件散热领域具有广阔的应用前景。使用激光技术对自支撑多晶金刚石膜进行微孔加工,并采用场发射环境扫描电子显微镜对微孔进行形貌分析。当激光功率达到17.6 W时,微孔表面发生破坏和断裂,断裂位置有明显的条纹结构,这可能是热应力引起的裂纹扩展、互连形成的。采用激光共聚焦扫描显微镜测量微孔剖面,进一步分析微孔锥度的变化,结果表明:微孔上端内表面粗糙,微孔锥度随着激光功率的增大而增大。使用激光拉曼光谱仪和X射线光电子能谱仪进行表面成分表征,以分析激光功率对微孔外表面及内表面的影响,以及缺陷产生的原因。结果显示:沉积物的主要成分为石墨,且石墨化程度随着激光功率的增加而增大。能量在向下传递过程中被金刚石吸收,并使金刚石石墨化;微孔下端接收的能量减少,因此微孔最终呈现为锥形。通过引入金刚石烧蚀阈值进行分析,揭示了激光微孔加工过程中的材料去除机理及微孔成形过程。在高激光功率下,微孔外表面出现破损,内表面出现明显的条纹状结构。微孔外表面及内表面的石墨化程度均随着激光功率的增加而增大。随着激光功率的增加,微孔锥度减小,微孔垂直度变好。激光在加工过程中对微孔内表面应力的影响大于对微孔边缘位置应力的影响。
Objective Diamond has high chemical stability,mechanical properties,high carrier mobility,and thermal conductivity,which has broad application prospects in many frontier fields.Diamond with micropores has good application prospects in high-precision lead forming and high-power microwave device heat dissipation.This study established the variation law of diamond hole patterns and defect characteristics under different laser powers.The diamond hole patterns and defect characteristics are vital in implementing the heat dissipation currently used in substrates for high-frequency electronics.The basic conditions can only be provided for the subsequent microporous metallization when the pore type meets the requirements,and the surface graphite residue and the pore wall are smooth.Methods In this study,laser technology was used to process micropores on self-supporting polycrystalline diamond films.By adjusting the laser power,the influence of laser power on diamond microporous molding was studied,the reaction mechanism of laserdiamond interaction was discussed,and the removal mechanism of diamond was analyzed.Field emission environment scanning electron microscopy was used for morphology analysis.Laser confocal scanning microscopy was used to measure microwell contours.Laser Raman spectroscopy and X-ray photoelectron spectroscopy were used for surface composition characterization to analyze the influence of laser power on the outer and inner surface of micropores and the causes of defects.The material removal mechanism and microhole forming process during laser microhole processing were revealed by introducing diamond ablation threshold analysis.Results and Discussions Morphology analysis was conducted by field emission environment scanning electron microscopy,and the results showed that the microporous surface had significant sedimentary layers and spherical deposits.When the power reaches 17.6 W,the surface of the micropores is damaged and fractured,and there is an obvious stripe structure at the fracture location,whi
作者
董春燕
张晓宇
顾德华
邵思武
刘金龙
陈良贤
李成明
魏俊俊
Dong Chunyan;Zhang Xiaoyu;Gu Dehua;Shao Siwu;Liu Jinlong;Chen Liangxian;Li Chengming;Wei Junjun(Institute for Advanced Materials and Technology,University of Science and Technology Beijing,Beijing 100083,China;Beijing Institute of Remote Sensing Equipment,Beijing 100854,China;Shunde Graduate School,University of Science and Technology Beijing,Foshan 528399,Guangdong,China)
出处
《中国激光》
EI
CAS
CSCD
北大核心
2023年第24期216-224,共9页
Chinese Journal of Lasers
基金
国家自然科学基金(52172037)
北京市自然科学基金(2212036)
佛山市科技创新专项(BK21BE004)。
关键词
激光技术
金刚石
微孔
石墨化
热应力
laser technology
diamond
micropore
graphitization
thermal stress
