摘要
在使用喷印工艺时,LGA器件回流焊后常发生空洞缺陷,对此产生的原因进行了分析。采用对LGA预上锡回流工艺和多点喷涂的方式,使回流过程中焊膏挥发出的气体更易于逸出。通过对比试验,找到合适的喷印图形和锡膏量,解决了喷印工艺下LGA器件焊接最常见的空洞问题。
During the spray printing process,the defects such as voids often occur in LGA devices after reflow soldering,and the reasons for this are analyzed.Through the pre tinning reflow process at the LGA devices and using multi-point spray printing on the solder pads,the volatile gas emitted by the solder paste during the reflow process is easier to escape.Through comparative experiments,suitable spray printing patterns and solder paste quantities are found to solve the most common voids problem in LGA device soldering under spray printing technology.
作者
余春雨
蒋庆磊
张成浩
刘刚
YU Chunyu;JIANG Qingei;ZHANG Chenghao;LIU Gang(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China)
出处
《电子工艺技术》
2024年第1期25-27,50,共4页
Electronics Process Technology
关键词
喷印
LGA
空洞
预上锡
spray printing
LGA
voids
pre tinning
