摘要
随着LED功率不断增大且其光电转换效率较低,使LED芯片的结温不断升高,这些热量若不能及时散出会影响LED使用寿命和其他方面性能。本文从LED芯片自身封装散热和外加散热器两种散热方式进行综述,分析了各个散热方法的优缺点以及在实际应用中需要解决的问题,并对未来LED散热方式进行了展望。本文对LED散热设计具有参考价值,有助于推动LED行业的发展。
As the power of LED(Light Emitting Diode)continues to increase and its photoelectric conversion efficiency remains low,the junction temperature of LED chips keeps rising.If the heat generated cannot be dissipated in a timely manner,it will affect the lifespan and overall performance of LEDs.This article provides an overview of two cooling methods:self⁃packaging heat dissipation of LED chips and external heat sinks.The advantages and disadvantages of each cooling method,as well as the issues that need to be addressed in practical applications,are analyzed.Furthermore,a projection of future LED cooling methods is presented.This article provides valuable reference for LED cooling design and contributes to the development of the LED industry.
作者
魏银
李月锋
邹军
郑浩
WEI Yin;LI Yuefeng;ZOU Jun;ZHENG Hao(School of Science,Shanghai Institute of Technology,Shanghai 201400,China;Kaikan Technology(Wuxi)Co.,Ltd.,Wuxi 214026,China)
出处
《中国照明电器》
2023年第9期1-11,共11页
China Light & Lighting
基金
2023年度上海应用技术大学协同创新基金(XTCX2023-21)。
关键词
大功率LED
封装技术
散热器
光电转换
结温
high⁃power LED
packaging technology
heat⁃sink
photoelectric conversion
junction temperature
