摘要
NP0特性多层陶瓷电容器(MLCC)在电子产品中广泛使用,在使用过程中不可避免会出现温度变化,芯片内部易产生热应力。应力会使MLCC内部瓷介在最薄弱的地方产生微裂纹,影响产品的可靠性。研究了排胶工艺对NP0特性薄介质MLCC热应力裂纹的影响。结果发现通过优化排胶工艺可以使得生坯中排胶后的残留碳减少,从而减少其在高温烧结过程中与内电极的氧化镍反应后导致瓷介存在的体积变化,可以有效预防NP0特性薄介质热应力裂纹的产生。
NP0 multilayer ceramic capacitor(MLCC)is widely used in electronics.It is inevitable that there will be temperature changes during operation,leading to thermal stress inside the chip.Stress can cause microcracks in the weakest part of the MLCC internal ceramic medium,affecting the reliability of the product.The effect of adhesive discharge process on the thermal stress cracks of NP0 thin medium MLCC is studied.The results show that the residual carbon in the green body can be reduced by optimizing the adhesive discharge process,thereby reducing the volume change of the ceramic medium caused by the reaction of nickel oxide with the inner electrode during high temperature sintering,which can effectively prevent the thermal stress crack of NP0 thin medium.
作者
邓丽云
陈长云
黄旭业
邱小灵
武垦生
DENG Liyun;CHEN Changyun;HUANG Xuye;QIU Xiaoling;WU Kensheng(State Key Laboratory of Advanced Materials and Electronic Components,Fenghua Advanced Technology Co.,Ltd.,Zhaoqing 526020,China)
出处
《电子工艺技术》
2023年第6期41-43,共3页
Electronics Process Technology
基金
广东省省属国有企业技术创新专项(2022B0101090003)。
关键词
NP0
MLCC
薄介质
排胶
碳残留
体积变化
热应力
裂纹
NP0 characteristics
MLCC
thin medium
adhesive discharge
carbon residue
volume change
thermal stress
crack
