摘要
为了避免石英摆式加速度计石英镀膜摆片人工焊接带来的个体差异,同时避免手工锡铅焊接助焊剂难清理导致多余物、不绝缘、焊点虚焊等风险,提出采用金丝键合工艺方法,在石英镀膜玻璃上键合金丝,实现石英摆式加速度计电气导通。通过对键合基体材料进行分析,选用热超声球-楔键合工艺方法,分别摸索影响金丝键合强度的关键因素(键合压力、键合时间、超声功率)中每个单因素工艺参数,确定单因素工艺参数的最优取值范围,并对具体参数采用正交试验法开展实验影响分析,快速、高效地确认金丝键合的最优工艺参数。对最优工艺键合参数进行装配验证,并对装配合格产品开展环境温度试验、力学试验、长时间可靠性增长试验等,最终验证金丝键合工艺方法可行。
In order to avoid the individual differences caused by the artificial welding of the quartz pendulum accelerometer quartz coated pendulum,and at the same time,in order to avoid the risks associated with manual tin-lead soldering,which is difficult for flux to clean and lead to excess materials,lack of insulation,solder joint soldering,etc.It was proposed to use the gold wire bonding process method to bond alloy wire on quartz coated glass so as to realize the electrical conduction of the quartz pendulum accelerometer.Through the analysis of bonding matrix materials,the thermal ultrasonic ball-wedge bonding process method was selected to explore the key factors affecting the bond strength of gold wire,bonding pressure,bonding time and ultrasonic power respectively,to determine the optimal value range of single-factor process parameters,and to carry out experimental impact analysis by orthogonal test method for specific parameters,so as to quickly and efficiently confirm the optimal process parameters of gold wire bonding.Assembly verification of optimal process bonding parameters was done.The ambient temperature test of the optimal process bonding point and the ambient temperature and mechanical experiments of the assembled accelerometer were carried out to verify the feasibility of the gold wire bonding process method.
作者
郭月
王建青
李蔚
王玉琢
郭伟
刘振宇
刘代鑫
GUO Yue;WANG Jianqing;LI Wei;WANG Yuzhuo;GUO Wei;LIU Zhenyu;LIU Daixin(Xi’an Aerospace Precision Electromechanical Institute,Xi’an 710100,China)
出处
《新技术新工艺》
2023年第10期42-46,共5页
New Technology & New Process
关键词
金丝键合
镀膜摆片
单因素
正交试验法
键合压力
键合时间
超声功率
gold wire bonding
coated pendulum
single-factor
orthogonal test method
bonding pressure
bonding time
ultrasound power
