摘要
电子元器件向着微型化、高集成化方向发展,对有机硅密封胶的性能提出了新的要求。为了提高其粘结强度、阻燃性能、机械性能和电气绝缘性能,以γ-(2,3环氧丙基)丙基三甲氧基硅烷(KH560)和羟基丙烯酸酯改性MQ硅树脂制得硅烷聚合物为增粘剂,乙烯基硅油为基料,含氢硅油为交联剂,气相白炭黑、硅微粉和氢氧化铝为补强材料,铂金复合体系为催化抑制剂,制备了有机硅密封胶,并研究不同组分对密封胶性能的影响。研究结果表明,当硅乙烯基∶硅氢的摩尔比为1∶1,MQ硅树脂的添加量为20%(以乙烯基硅油的质量分数为基准,下同)、增粘剂为1.5%、气相白炭黑为6%、硅微粉为20%、氢氧化铝为30%时,制备的有机硅密封胶综合性能优异,其剪切强度为4.72 MPa,拉伸强度为4.91 MPa,断裂伸长率为146%,阻燃性能达到V-0级,相比电痕化指数为600 V,完全可以满足电子元器件的发展对密封胶新的技术要求。
The development of the electronic components is shifting towards the miniaturization and high level of integration,which in turn raised the bar for the performance of the silicone sealant.In order to improve the adhesiveness,flame retardancy,mechanical and electrical insulation properties of the silicone sealant,high-performance silicone sealant was prepared using the polymer ofγ-(2,3-epoxypropoxy)propyl-trimethoxysilane(KH560)and hydroxyethyl acrylate modified MQ silicone resin to obtain silane polymer as the adhesion promoter,vinyl silicone oil as the base material,hydrogen silicone oil as the crosslinker,fumed silica,silicon micro-powder and aluminum hydroxide as the reinforcing materials,and platinum composite system as the catalytic inhibitor.In this paper,the effects of different components on the properties of the silicone sealant were discussed and the optimum formula was identified.The test results show that the best formula of the silicone sealant is as follows:n(Si-Vi/Si-H)is 1∶1,the content of the MQ silicone resin is 20%(wt%of vinyl silicone oil,the same below),the tackifier is 1.5%,the fumed silica is 6%,the silicon micro-powder is 20%,the aluminum hydroxide is 30%.The prepared silicone sealant demonstrated excellent properties,the shear strength of 4.72 MPa,a tensile strength of 4.91 MPa,an elongation at break of 146%,a flammability rating of UL94 V-0 and a comparative tracking index(CTI)of 600 V can be achieved.This sealant can fully address the technical demands emerged from the new type of the electronic components.
作者
张青
侯陈睿
王谊
ZHANG Qing;HOU Chenrui;WANG Yi(School of Automation and Information Engineering,Xian University of Technology,Xian710048,China;International Engineering College,Xian University of Technology,Xian710048,China)
出处
《电子元件与材料》
CAS
北大核心
2023年第7期893-898,共6页
Electronic Components And Materials
基金
陕西省科技厅“两链”融合重点专项(2022JBGS3-01)。
关键词
电子元器件
有机硅密封胶
相比电痕化指数
力学性能
阻燃性能
electronic components
silicone sealant
comparative tracking index
mechanical properties
flame retardant
